About 1,009,155 results (3,213 milliseconds)

How to Get Rid of Calcium Deposits

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In that case, your doctors will discuss what it means and your treatment options. Breast lumps should be investigated by your doctor regardless of what you ...

US5924623A - Diffusion patterned C4 bump pads - Google Patents

https://patents.google.com/patent/US5924623A/en
... bumps on the respective pads. Flux may then be applied to the solder bumps ... In a liquid it causes surface tension. The surface tension in the molten ...

Blog | Delaware Foot and Ankle Group | Newark, DE

https://news.google.com/rss/articles/CBMiUGh0dHBzOi8vd3d3LmRlZm9vdGFuZGFua2xlZ3JvdXAubmV0L2Jsb2cvOTY5MTgyLXRyZWF0aW5nLWZvb3QtYW5kLWFua2xlLWluanVyaWVz0gEA?oc=5
Stretching the calves, Achilles tendon, and lower back can help relieve tension caused by foot misalignment. Contact Our Podiatrist Today Ensure you understand ...

US5466635A - Process for making an interconnect bump for flip ...

https://patents.google.com/patent/US5466635A/en
These dimensions can be determined theoretically or empirically such that the surface tension which is present during the reflow step causes the cap 30 to flow ...

JP2022506522A - A device for tightening screw fasteners - Google ...

https://patents.google.com/patent/JP2022506522A/en
Direct multi-tension indicating washer having bumps of a first and second height. US6461093B1 2000-09-05 2002-10-08 John K. Junkers Threaded fastener.

WO2010053943A1 - Vacuum-insulated glass windows with glass ...

https://patents.google.com/patent/WO2010053943A1/un
... causes bump formation is controlled by the surface tension of the molten glass. ... bumps. glass-bump spacers 50 are formed in one side 22M of glass pane ...

US5886362A - Method of reflowing solder bumps after probe test ...

https://patents.google.com/patent/US5886362A/en
After probe testing, solder pads 14-18 are reflowed into half-hemisphere shaped solder bumps 28-32 by surface tension using conventional integrated circuit ...

US8460794B2 - Self-aligned wafer bonding - Google Patents

https://patents.google.com/patent/US8460794B2/en
Jan 13, 2011 ... In particular, the present disclosure relates to a self-alignment technique utilizing liquid surface tension to align complimentary hydrophilic ...

US6566612B2 - Method for direct chip attach by solder bumps and ...

https://patents.google.com/patent/US6566612B2/en
The flux-containing underfill layer makes up a small portion of the composite underfill thickness. During curing of the underfill layer, the solder bump needs ...

US20030178474A1 - Integrated circuit assemblies and assembly ...

https://patents.google.com/patent/US20030178474A1
The C4 flip-chip bonding process also exhibits surface tension between the solder bump ... plasma treating the bumps to remove oxide from bumps;. applying flux- ...

EP3031853A1 - Polypropylene films with improved printability ...

https://patents.google.com/patent/EP3031853A1/en
... bumps on the polyolefin surfaces and has a ... Corona treatment increases the surface energy of the film and consequently its surface tension.

US8955358B2 - Vacuum-insulated glass windows with glass-bump ...

https://patents.google.com/patent/US8955358B2/en
... causes bump formation is controlled by the surface tension of the molten glass. This effect is exploited by using a focused laser beam 112F having a ...

US20090243080A1 - Flip Chip Interconnection Structure with Bump ...

https://patents.google.com/patent/US20090243080A1/en
During the wetting process, the surface tension of the solder flux material causes the solder bump 32 to reflow across and adhere to surface 46 of contact pad ...

US6495397B2 - Fluxless flip chip interconnection - Google Patents

https://patents.google.com/patent/US6495397B2/en
The molten solder bumps wet the corresponding metal bumps and the surface tension of the molten solder causes the metal bumps to self-align with each of the ...

EP0248566A2 - Process for controlling solder joint geometry when ...

https://patents.google.com/patent/EP0248566A2/en
As the melting occurs, the surface tension of the resulting molten solder joints and gravity causes the package 522 to be pulled toward the substrate 521, and ...

US6566234B1 - Semiconductor flip-chip package and method for ...

https://patents.google.com/patent/US6566234B1/en
The encapsulant 22 and solder bumps 14 are moved into intimate contact with the substrate 20 and solder pads 12, respectively. The assembly is heated to cure ...

What to make of Clippers' chemistry after reported tension stemming ...

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Jan 23, 2020 ... Off the court, sources say there are some teammates who have struggled with the organization's preferential treatment that is afforded to ...

WO2014205103A1 - Dynamic tension system for orthopedic device ...

https://patents.google.com/patent/WO2014205103A1/en
... tension in the cable, in that tension in winding at the predetermined level of tension causes the torque-limiting tool to fail. The tension control device ...

US11181704B2 - Fabrication method of high aspect ratio solder ...

https://patents.google.com/patent/US11181704B2/en
... tension of fluid solder to align the elements, e.g. solder bump techniques. G ... H01L2224/118 Post-treatment of the bump connector. H01L2224/1181 ...